smt smd pcba assembly manufactur

Multilayer PCB Promotion In June

– 12% discount for multilayer PCBs

– more surprises for regular customers

Deadline: July 5th,2015

Advantages

– No MOQ

– OEM services provided

– Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB  manufacturable

– Factory direct price

– Replying with price in one working day

– Shipping within 24 hours

– Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

PCB Capacity

PCB General Capability
Number of Layer	1 – 20 Layer
Maximum Processing Area	680 × 1000MM
Min Board Thickness	2 Layer – 0.3MM ( 12 mil )
	4 Layer – 0.4MM ( 16 mil )
	6 Layer – 0.8MM ( 32 mil )
	8 Layer – 1.0MM ( 40 mil)
	10 Layer – 1.1MM ( 44 mil )
	12 Layer – 1.3MM ( 52 mil )
	14 Layer – 1.5MM ( 59 mil )
	16 Layer – 1.6MM ( 63 mil )
	18 Layer – 1.8MM ( 71 mil )
Finished Board Thickness Tolerance	Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
	1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending	≤ 0.75%, Min: 0.5%
Range of TG	130 – 215 ℃
Impedance Tolerance	± 10%, Min: ± 5%
Hi-Pot Test	Max: 4000V/10MA/60S
Surface Treatment	HASL, With Lead, HASL Free Lead
	Flash Gold, Immersion Gold
	Immersion Silver, Immersion Tin
	Gold Finger, OSP

PCB Cu Thickness + Plating
Out Layer Cu Thickness	1 – 6OZ
Inner Layer Cu Thickness	0.5 – 4OZ
Cu Thickness of PTH	20UM ≤ Average ≤ 25UM
	Min: 18UM
HASL with Lead	Tin 63% Lead 37%
HASL Free Lead	7UM ≤ Surface Thickness ≤ 12UM
Thick Gold Plating	Ni Thickness: 3 – 5UM ( 120u” – 200u” )
	Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” )
Immersion Gold	Ni Thckness: 3 – 5UM ( 120u” – 200u” )
	Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” )
Immersion Silver	Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” )
Gold Finger	Ni Thickness: 3 – 5UM ( 120u” – 160u” )
	Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” )

U940 PCB Pattern Limit Capability
Min Width	0.075MM ( 3 mil )
Min Trace	0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer )	0.15MM ( 6 mil )
Min Width of Ring ( Out Layer )	0.1MM ( 4 mil )
Min Solder Bridge	0.1MM ( 4 mil )
Min Height of Legend	0.7MM ( 28 mil )
Min Width of Legend	0.15MM ( 6 mil )

PCB Holes Processing Capability
Final Hole Size	Min: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size	0.10 – 6.5MM
Drilling Tolerance	NPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH )	φ0.20 – 1.60MM ± 0.075MM
	φ1.60 – 6.30MM ± 0.10MM
Final Hole Size Tolerance ( NPTH )	φ0.20 – 1.60MM ± 0.05MM
	φ1.60 – 6.50MM ± 0.05MM
Drilling Strip Hole	-0L ~tu.’gth /width 2:1
	Min Strip Hole Width 0.65MM
	Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size	≤ 10:1

PCB Cover Thickness Capability
Solder Mask Color	Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask Thickness	Surface Line ≥ 10UM
	Surface Line Corner ≥ 6UM
	Surface Board 10 – 25UM
	Solder Mask Bridge Width
Legend Color	White,Yellow,Black
Min Height of Legend	0.70MM ( 28 mil )
Min Width of Legend	0.15MM ( 6 mil )
Blue Gel Thickness	0.2 – 1.5MM
Blue Gel Tolerance	±0.15MM
Carbon Print Thickness	5 – 25UM
Carbon Print Min Space	0.25MM
Carbon Print Impedance	200Ω

Blind/Burried/Half Via PCB Capability
Parameters	(1+1)e.g.(4-layer)blind via:1-2,2-4(6-layer)buried via:2-3,3-4 (8-layer)blind/buried:1-3,4-5,6-8
Min Via	Laser 0.1MM, Machine 0.2MM
Half Via	Min: 0.6MM

Impedance Capability
Resistance Value	Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω

PCBA Capability

Our PCBA Capability

SMT, PTH, mixed technology

SMT: 2,000,000 solder joints per day

DIP: 300,000 joints per day

Ultra fine pitch, QFP, BGA, μBGA, CBGA

Advanced SMT assembly

Automated insertion of PTH (axial, radial, dip)

Cleanable, aqueous and lead-free processing

RF manufacturing expertise

Peripheral process capabilities

Pressfit back planes & mid planes

Device programming

Automated conformal coating

For E-Test

Universal Tester

Flying Probe Open/Short Tester

High power Microscope

Solder ability Testing Kit

Peel Strength tester

High Volt Open & Short tester

Cross Section Molding Kit With Polisher

If you need PCB assembly service as well, could you give us following information?
1.	Gerber file of the bare PCB board
2.	BOM(Bill of material) for assembly
To short the Lead time, please kindly advise us if there is any acceptable components substitution.
3.	Testing Guide & Test Fixtures, if necessary
4.	Programming files & Programming tool, is necessary
5.	Schematic, if necessary

Our Production Capability for PCB

Number of Layer	1 – 20 Layer
Maximum Processing Area	680 × 1000MM
Min Board Thickness	2 Layer – 0.3MM ( 12 mil )
	4 Layer – 0.4MM ( 16 mil )
	6 Layer – 0.8MM ( 32 mil )
	8 Layer – 1.0MM ( 40 mil)
	10 Layer – 1.1MM ( 44 mil )
	12 Layer – 1.3MM ( 52 mil )
	14 Layer – 1.5MM ( 59 mil )
	16 Layer – 1.6MM ( 63 mil )
	18 Layer – 1.8MM ( 71 mil )
Finished Board Thickness Tolerance	Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
	1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending	≤ 0.75%, Min: 0.5%
Range of TG	130 – 215 ℃
Impedance Tolerance	± 10%, Min: ± 5%
Hi-Pot Test	Max: 4000V/10MA/60S
Surface Treatment	HASL, With Lead, HASL Free Lead
	Flash Gold, Immersion Gold
	Immersion Silver, Immersion Tin
	Gold Finger, OSP

We provide OEM services to all sorts of printed circuit board assembly as well as electronic encased products.